
Mechanical Engineering
University of Alberta
Mechanical Engineering
University of Alberta
junghwa1 at ualberta.ca
jungwhan0810 at gmail.com
junghwa1 at ualberta.ca
jungwhan0810 at gmail.com
Jung-Hwan Youn (he/him/his)
Jung-Hwan Youn (he/him/his)
Jung-Hwan Youn is an assistant professor in the Department of Mechanical Engineering at the Univerity of Alberta. Prior to joining the University of Alberta, he was a postdoctoral researcher at the University of Illinois Urbana-Champaign (UIUC) in US and Electronics and Telecommunications Research Institute in Korea. He earned his Ph.D. in Mechanical Engineering from the Korea Advanced Institute of Science and Technology (KAIST).
Jung-Hwan Youn is an assistant professor in the Department of Mechanical Engineering at the Univerity of Alberta. Prior to joining the University of Alberta, he was a postdoctoral researcher at the University of Illinois Urbana-Champaign (UIUC) in US and Electronics and Telecommunications Research Institute in Korea. He earned his Ph.D. in Mechanical Engineering from the Korea Advanced Institute of Science and Technology (KAIST).
PROFESSIONAL ACTIVITIES
PROFESSIONAL ACTIVITIES
• Organizing Committee
- Finance Chair for IEEE RoboSoft ’28
- Student Innovation Challenge Chair for IEEE WHC ’27
• Program Committee (Associate Editor)
- IEEE Haptics Symposium ’26
- ACM UIST ’25, ’26
- ACM CHI ’25 (LBW)
• Review Editor
- Frontiers in Robotics & AI (Robot Design) 2023–
• Reviewer
- Nature Communications
- IEEE/ASME Transactions on Mechatronics
- IEEE Transactions on Industrial Electronics
- IEEE Transactions on Haptics
- Soft Robotics
- IEEE Robotics and Automation Letter
- ACM CHI, ACM UIST
- IEEE ICRA, IEEE/RSJ IROS, IEEE RoboSoft
- IEEE WHC, IEEE HS, IEEE RO-MAN, IEEE ROBIO
• Organizing Committee
- Finance Chair for IEEE RoboSoft ’28
- Student Innovation Challenge Chair for IEEE WHC ’27
• Program Committee (Associate Editor)
- IEEE Haptics Symposium ’26
- ACM UIST ’25, ’26
- ACM CHI ’25 (LBW)
• Review Editor
- Frontiers in Robotics & AI (Robot Design) 2023–
• Reviewer
- Nature Communications
- IEEE/ASME Transactions on Mechatronics
- IEEE Transactions on Industrial Electronics
- IEEE Transactions on Haptics
- Soft Robotics
- IEEE Robotics and Automation Letter
- ACM CHI, ACM UIST
- IEEE ICRA, IEEE/RSJ IROS, IEEE RoboSoft
- IEEE WHC, IEEE HS, IEEE RO-MAN, IEEE ROBIO
AWARDS AND HONORS
AWARDS AND HONORS
• Distinguished Demonstration Award, IEEE Haptics Symposium 2026
• Young Scientist Award, Active Materials and Soft Mechanisms 2024
• Best Poster Award, MRS 2024
• Best Paper Award, Korea Haptics Conference 2024
• The Runner-Up Award, IEEE ICRA Workshop 2023
• The 2nd Best Paper Award, Korea Robotics Society Annual Conference 2021
• Best Paper Award in Mechanical Engineering, Applied Sciences 2020
• Best Paper Award, Active Materials and Soft Mechanisms 2019
• Best Student Innovation Challenge Award, IEEE World Haptics Conference 2019
• The 3rd Place for Wearable Challenge Award, IEEE RoboSoft 2019
• Best TA Awards, Department of Mechanical Engineering, KAIST 2019 & 2021
• Distinguished Demonstration Award, IEEE Haptics Symposium 2026
• Young Scientist Award, Active Materials and Soft Mechanisms 2024
• Best Poster Award, MRS 2024
• Best Paper Award, Korea Haptics Conference 2024
• The Runner-Up Award, IEEE ICRA Workshop 2023
• The 2nd Best Paper Award, Korea Robotics Society Annual Conference 2021
• Best Paper Award in Mechanical Engineering, Applied Sciences 2020
• Best Paper Award, Active Materials and Soft Mechanisms 2019
• Best Student Innovation Challenge Award, IEEE World Haptics Conference 2019
• The 3rd Place for Wearable Challenge Award, IEEE RoboSoft 2019
• Best TA Awards, Department of Mechanical Engineering, KAIST 2019 & 2021
INVITED TALKS
INVITED TALKS
• Korea University (KR), hosted by Prof. Sungjoon Choi, 2026
• IEEE RoboSoft Workshop (Bridging Soft Robotics and Human Computer Interaction), 2026
• University of Alberta (CA), hosted by Prof. John Doucette, 2026
• Saint Louis University (US), hosted by Prof. Jenna Gorlewicz, 2026
• Rochester Institute of Technology (US), hosted by Prof. Qian Xue, 2026
• University of Wisconsin–Madison (US), hosted by Prof. Frank Pfefferkorn, 2026
• Florida State University (US), hosted by Prof. Jonathan Clark, 2026
• University of Chicago (US), hosted by Prof. Pedro Lopes, 2025
• Purdue University (US), hosted by Prof. Yu She, 2025
• University of Illinois Urbana-Champaign (US), hosted by Prof. Joohyung Kim, 2025
• KAIST (KR), hosted by Prof. Ki-Uk Kyung, 2025
• IEEE WHC Workshop (Emerging Challenges in Wearable Haptics), 2025
• IEEE WHC Workshop (Shape Displays: Challenges for Tangible Interactions), 2025
• University of Illinois Urbana-Champaign (US), hosted by Prof. Wenzhen Yuan, 2024
• Korea University (KR), hosted by Prof. Sungjoon Choi, 2026
• IEEE RoboSoft Workshop (Bridging Soft Robotics and Human Computer Interaction), 2026
• University of Alberta (CA), hosted by Prof. John Doucette, 2026
• Saint Louis University (US), hosted by Prof. Jenna Gorlewicz, 2026
• Rochester Institute of Technology (US), hosted by Prof. Qian Xue, 2026
• University of Wisconsin–Madison (US), hosted by Prof. Frank Pfefferkorn, 2026
• Florida State University (US), hosted by Prof. Jonathan Clark, 2026
• University of Chicago (US), hosted by Prof. Pedro Lopes, 2025
• Purdue University (US), hosted by Prof. Yu She, 2025
• University of Illinois Urbana-Champaign (US), hosted by Prof. Joohyung Kim, 2025
• KAIST (KR), hosted by Prof. Ki-Uk Kyung, 2025
• IEEE WHC Workshop (Emerging Challenges in Wearable Haptics), 2025
• IEEE WHC Workshop (Shape Displays: Challenges for Tangible Interactions), 2025
• University of Illinois Urbana-Champaign (US), hosted by Prof. Wenzhen Yuan, 2024